Single mask method of fabricating complementary integrated circu

Metal treatment – Compositions – Heat treating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148187, 357 34, 357 43, 357 91, H01L 21263, B01J 1700

Patent

active

042447526

ABSTRACT:
A method of fabricating an integrated circuit having a plurality of different devices, which method employs a single mask to define the active areas of all such devices. A silicon oxide-silicon nitride layer is formed on the surface of a silicon wafer so as to define the location of subsequent oxide insulating layers which in turn actually define all the active areas of the circuit. Respective active areas for the different devices can then be formed by selective ion implantation.

REFERENCES:
patent: 3853633 (1974-12-01), Armstrong
patent: 3868274 (1975-02-01), Hubar et al.
patent: 3928081 (1975-12-01), Marley, Jr. et al.
patent: 3983620 (1976-10-01), Spadea
patent: 4001048 (1977-01-01), Meiling et al.
patent: 4005450 (1977-01-01), Yoshida et al.
patent: 4009057 (1977-02-01), De Brebisson et al.
patent: 4045250 (1977-08-01), Dingwall
patent: 4046606 (1977-09-01), Lambert
patent: 4052229 (1977-10-01), Pashley
patent: 4101344 (1978-07-01), Kooi et al.
patent: 4104784 (1978-08-01), Klein
Enomoto et al., ". . . Oxidation . . . Si.sub.3 N.sub.4 Film . . . "Jap. Journ. Appl. Phys. 17 (1978) 1049.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Single mask method of fabricating complementary integrated circu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Single mask method of fabricating complementary integrated circu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Single mask method of fabricating complementary integrated circu will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2229742

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.