Single loading mechanism to apply force to both cooling...

Details Single loading mechanism to apply force to both cooling... Single loading mechanism to apply force to both cooling...

2006-06-27

2008-09-23

Duverne, J. F. (Department: 2839)

Electrical connectors

With provision to dissipate, remove, or block the flow of heat

Distinct heat sink

Reexamination Certificate

active

07427210

ABSTRACT:
Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.

REFERENCES:
patent: 6672892 (2004-01-01), Chandran et al.
patent: 6731506 (2004-05-01), Dong et al.
patent: 7195507 (2007-03-01), Watanabe
patent: 7230830 (2007-06-01), Ujike et al.
patent: 2005/0111188 (2005-05-01), Bhattacharya et al.
patent: 2005/0218035 (2005-10-01), Pearson et al.
patent: 2006/0046527 (2006-03-01), Stone et al.
patent: 2006/0091538 (2006-05-01), Kabadi
patent: 2006/0094265 (2006-05-01), Zheng
LGA775 Socket Mechanical Design Guide, Feb. 2006, Intel Corporation, Document No. 302666-003, 25 pages.

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