Metal fusion bonding – Process – Plural joints
Patent
1987-07-01
1989-04-18
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228213, 228 45, 228 447, B23K 3102, B23K 522, B23K 3700
Patent
active
048219452
ABSTRACT:
A system of single lead clamping and bonding in the assembly of integrated circuit devices. A capillary bonder has a clamp member rotatably mounted around the capillary for movement with the bond head. The clamp is moveable vertically to contact and clamp a terminal to be bonded. The clamp is rotatable to orient itself with respect to the terminal and the fine wire. The capillary and clamp move under computer control to make a series of bonds, typically between lead frame fingers and terminals on a semiconductor device.
REFERENCES:
patent: 3596044 (1971-07-01), Katzin
patent: 3672556 (1972-06-01), Diepeveen
patent: 3806019 (1974-04-01), Diepeveen
patent: 3863827 (1975-02-01), Foulke et al.
patent: 3894671 (1975-07-01), Kulicke et al.
patent: 4053096 (1977-10-01), Heim
patent: 4142714 (1979-03-01), Diepeveen
patent: 4202482 (1980-05-01), Sade et al.
patent: 4213556 (1980-07-01), Persson et al.
patent: 4437604 (1984-03-01), Razon et al.
patent: 4475681 (1984-10-01), Ingle
patent: 4485957 (1984-12-01), Sugimoto et al.
patent: 4527730 (1985-07-01), Shirai et al.
Research Disclosure, #26622, Kenneth Mason Publ. Ltd., Jun. 1986, No. 266.
Chase Judith A.
Phelps, Jr. Douglas W.
Redmond Robert J.
Starr Stephen G.
Cuda Carmine
Godici Nicholas P.
International Business Machines
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