Single inline packaged solid state relay with high current densi

Details Single inline packaged solid state relay with high current densi Single inline packaged solid state relay with high current densi

1991-07-22

1992-07-28

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437217, 437221, 357 70, H01L 2160

Patent

active

051340941

ABSTRACT:
An AC solid state relay in a single inline package (SIP) comprised of dual silicon controlled rectifiers (SCRs) with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy. And a DC solid state relay in a single inline package (SIP) comprised of an NPN power transistor with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy.

REFERENCES:
patent: 3723769 (1973-03-01), Collins
patent: 4172272 (1979-10-01), Schneider
patent: 4471158 (1984-09-01), Roberts
patent: 4725692 (1988-02-01), Ishit et al.
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4893168 (1990-01-01), Takahashi
patent: 5012323 (1991-04-01), Farnworth
patent: 5036024 (1991-07-01), Mine et al.

Affiliated with

Also associated with

Rating

Single inline packaged solid state relay with high current densi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Single inline packaged solid state relay with high current densi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Single inline packaged solid state relay with high current densi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1686891