Single inline packaged solid state relay with high current densi

Details Single inline packaged solid state relay with high current densi Single inline packaged solid state relay with high current densi

1992-03-24

1993-06-15

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257177, H01L 2302, H01L 2974

Patent

active

052201970

ABSTRACT:
An AC solid state relay in a single inline package (SIP) comprised of dual silicon controlled rectifiers (SCRs) with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy. And a DC solid state relay in a single inline package (SIP) comprised of an NPN power transistor with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy.

REFERENCES:
patent: 3839660 (1974-10-01), Stryker
patent: 4471158 (1984-09-01), Roberts
patent: 4725692 (1988-02-01), Ishit et al.
patent: 4731644 (1988-03-01), Neidig
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4893168 (1990-01-01), Takahashi
patent: 5012323 (1991-04-01), Farnworth
patent: 5036024 (1991-07-01), Mine et al.

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