Single in-line high power resin-packaged semiconductor device ha

Details Single in-line high power resin-packaged semiconductor device ha Single in-line high power resin-packaged semiconductor device ha

1976-11-23

1978-06-13

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 79, 174 16HS, 165 80, H01L 2338, H01L 2342, H01L 2344

Patent

active

040952533

ABSTRACT:
A single in-line, high power, resin-packaged semiconductor device having a plurality of external leads disposed in parallel to each other and projecting from one side surface of a resin-molded package, wherein a heat sink fin mounting plate is formed in unitary structure with a plate for carrying a semiconductor pellet and arranged to project from a recessed portion of the opposite side surface of the resin-molded package and a heat sink fin has one end bent in U-shape and caulked on the fin mounting plate and the remaining portion overlapping one principal surface of the resin-molded package. The projection of the heat sink fin from the resin-molded package can be reduced to enable the device to be assembled in compact electronic instruments or devices. Heat dissipation efficiency can also be improved by mounting the semiconductor device on a chassis with the heat sink fin brought in contact with the chassis.

REFERENCES:
patent: 2955242 (1960-10-01), Darziale
patent: 3548927 (1970-12-01), Spurling
patent: 3606673 (1971-09-01), Overman
patent: 3694703 (1972-09-01), Wilens et al.
patent: 3786317 (1974-01-01), Thierfelder
patent: 3893161 (1975-07-01), Pesak

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