Single IC packaging solution for multi chip modules

Details Single IC packaging solution for multi chip modules Single IC packaging solution for multi chip modules

2007-02-20

2007-02-20

Potter, Roy Karl (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S723000

Reexamination Certificate

active

10754807

ABSTRACT:
A multilayer printed circuit board (PCB) interface includes a top PCB layer, a middle PCB layer, and a bottom PCB layer. A top surface of the top PCB layer receives at least one top module. The middle PCB layer includes an electrically conductive layer disposed between two dielectric layers. The electrically conductive layer forms a plurality of connectors protruding horizontally from the sides of the multilayer PCB to couple the PCB interface to a main board. A bottom surface of the bottom PCB layer receives at least one bottom module.

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