Single footprint family of integrated power modules

Details Single footprint family of integrated power modules Single footprint family of integrated power modules

2011-08-16

2011-08-16

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S836000

Reexamination Certificate

active

07996987

ABSTRACT:
A system and method for producing a family of power modules having a common footprint that enables the customer to flexibly choose a power module size without incurring the costs of a relayout of a system design. In one embodiment, a board layout can be designed using a selected power module footprint size that supports an installation of any of a plurality of power modules. The power module that is used in a board layout can be selected based on a measurement of an amount of power consumed by the one or more loads.

REFERENCES:
patent: 4489365 (1984-12-01), Daberkoe
patent: 4965710 (1990-10-01), Pelly et al.
patent: 5959845 (1999-09-01), Faucher
patent: 6496383 (2002-12-01), Herrell et al.
patent: 6740969 (2004-05-01), Hirashima
patent: 6982574 (2006-01-01), Harriman et al.
patent: 7086019 (2006-08-01), Keller et al.
patent: 7088004 (2006-08-01), Standing
patent: 7187562 (2007-03-01), Stojcic et al.
patent: 7231535 (2007-06-01), Le Creff et al.
patent: 7256479 (2007-08-01), Noquil et al.
patent: 7285973 (2007-10-01), Mardi et al.
patent: 7363525 (2008-04-01), Biederman et al.
patent: 2002/0136042 (2002-09-01), Layden et al.
patent: 2003/0085456 (2003-05-01), Lee et al.
patent: 2004/0027103 (2004-02-01), Boylan
patent: 2004/0057208 (2004-03-01), Baeumel et al.
patent: 2004/0168818 (2004-09-01), Layden et al.
patent: 2004/0201094 (2004-10-01), Sato et al.
patent: 2004/0207055 (2004-10-01), Iwasa
patent: 2004/0245969 (2004-12-01), McClean
patent: 2005/0121764 (2005-06-01), Mallik et al.
patent: 2005/0240605 (2005-10-01), Knoblock et al.
patent: 2006/0146504 (2006-07-01), Belson et al.
patent: 2006/0220191 (2006-10-01), Sundstrom
patent: 2006/0238332 (2006-10-01), Carle et al.
patent: 2007/0023889 (2007-02-01), Salmon
patent: 2007/0108580 (2007-05-01), Goller
patent: 2008/0035612 (2008-02-01), Chang et al.
Freescale Semiconductor, Single Intelligent High-Current Self-Protected Silicon High Side Switch (2.0mΩ), Document No. MC33982, Rev. 13.0, Jul. 2007.
European Search Report.

Affiliated with

Also associated with

Rating

Single footprint family of integrated power modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Single footprint family of integrated power modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Single footprint family of integrated power modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2715604