Single crystal wafers

Details Single crystal wafers Single crystal wafers

1996-07-02

1998-08-11

Zirker, Daniel

Stock material or miscellaneous articles

Composite

Of inorganic material

225 96, 225 965, 117902, H01L 21304

Patent

active

057925666

ABSTRACT:
Improved commercial single crystal wafers (250), as shipped to end users form a full circle, and comprise a "stress concentration notch" (172) which accurately defines a desired cleavage plane. The stress concentration notch is introduced into the wafers in bulk by means of a properly oriented cut along the length of a single crystal ingot, after machining the ingot to the desired end product diameter, and prior to sawing the ingot into slices. The stress concentration notch uniquely defines the first and second faces of the wafer.

REFERENCES:
patent: 3507426 (1970-04-01), Bielen et al.
patent: 3743148 (1973-07-01), Carlson
patent: 4442178 (1984-04-01), Kimura et al.
patent: 4632884 (1986-12-01), Shikatani et al.
patent: 4755314 (1988-07-01), Sakaguchi et al.

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