Single crystal substrate and cutting method thereof

Details Single crystal substrate and cutting method thereof Single crystal substrate and cutting method thereof

2007-06-19

2007-06-19

Budd, Mark (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S31300R

Reexamination Certificate

active

10517067

ABSTRACT:
A single crystal substrate and a cutting method thereof are provided. The single crystal substrate includes a langasite substrate with a SAW propagation surface; and input and output IDTs having electrodes on the surface for launching and/or detecting surface acoustic waves, wherein a direction of surface wave propagation is parallel to an X′-axis, and the substrate farther has an Z′-axis perpendicular to the surface and a Y′-axis parallel to the surface and perpendicular to the X′-axis, the langasite substrate having a crystal orientation defined by modified axes X, Y and Z, the relative orientation of axes X′, Y′ and Z′ being defined by Euler angles φ, θ and ψ, in which φ is in a range of 8°≦φ≦25°, θ in a range of 15°≦θ≦30°, and ψ is in a range of 55°≦ψ≦85°.

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