Single-crystal silicon ingot and wafer having homogeneous...

Stock material or miscellaneous articles – Composite – Of silicon containing

Reexamination Certificate

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C428S064100, C423S348000, C117S935000

Reexamination Certificate

active

07125608

ABSTRACT:
The present invention improves upon the Czochralski method for growing a single-crystal silicon ingot and provides a high quality silicon wafer having an oxide layer with superior voltage-resistance characteristics. An apparatus and method are also provided, whereby vacancy defect density and distribution are uniformly controlled. A single-crystal silicon ingot is grown under a condition where the temperature variation of the ingot is less than or equal to 20° C./cm in the temperature range of 1000 to 1100° C.

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