Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-02-07
2006-02-07
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C029S025350, C029S446000, C310S311000, C310S340000
Reexamination Certificate
active
06994762
ABSTRACT:
A single crystal piezo (SCP) apparatus and method of forming same. The apparatus is ideally suited for actuator and energy harvesting applications. The apparatus includes an SCP layer bonded to a surface of a flexible metal layer while the metal layer is held flattened within a press or other tool. Once the bonding process is complete, the metal layer imparts a compressive strain to the SCP layer bonded thereto. A layer of uniaxial graphite may also be bonded to the SCP layer to eliminate the poison's ratio tension that would otherwise be created in the SCP layer.
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Clingman Dan J.
Jacot A. Dean
Aftergut Jeff H.
Harness & Dickey & Pierce P.L.C.
The Boeing Company
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