Single alloy solder clad substrate

Details Single alloy solder clad substrate Single alloy solder clad substrate

1994-12-02

1997-04-22

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, H05K 102

Patent

active

056231270

ABSTRACT:
A solder clad printed circuit board (100) consists of an electrically insulating substrate that has copper circuit traces (105), portions of which are solderable. A substantially planar layer (120) of a soldering composition is fused to the solderable traces, to form a solder pad that is not domed. The layer is composed of a mass of off-eutectic solder particles (115) that are fused together to form an agglomeration (120) having a porous structure. The solder particles are fused together by heating the off-eutectic solder to a temperature that is between the solidus temperature and the liquidus temperature of the solder. The solder is then cooled below the solidus temperature to solidify it.

REFERENCES:
patent: 3621442 (1971-11-01), Racht
patent: 4914814 (1990-04-01), Behun et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5178965 (1993-01-01), Tench et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5458281 (1995-10-01), Downing et al.

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