Simultaneous soldering of a plurality of devices

Details Simultaneous soldering of a plurality of devices Simultaneous soldering of a plurality of devices

1978-01-30

1979-03-27

Lanham, C. W.

Metal fusion bonding

Process

Plural joints

228212, 29760, B23K 3704

Patent

active

041461665

ABSTRACT:
In making diode bridges 16, it is desirable to solder a plurality of such bridges simultaneously. To accomplish this a plurality of diodes 10 are held by a portion of one lead each in a cantilevered fashion in each of four in-line racks 38, 40, 50 and 52. The four racks 38, 40, 50 and 52, with diodes 10 extending therefrom, are held at a fixed angle and fixed spacing with respect to each other to interleave the diode leads 14 and form channels. Solder wire 62 is placed in each of the channels. The diodes 10 and the solder wires 62 are then placed into either a heated gas or heated saturated vapor to melt the solder at the crosspoints 60 of the leads 14. Troughs 64 are provided adjacent the crosspoints 60 to catch any solder runoff which occurs during the melting.

REFERENCES:
patent: 1456506 (1923-05-01), Leveridge
patent: 2699133 (1955-01-01), Ames et al.
patent: 3286339 (1966-11-01), Kennard et al.
patent: 3310867 (1967-03-01), Ehrat et al.
patent: 3904102 (1975-09-01), Chu et al.
patent: 4074420 (1978-02-01), Lofdahl

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