Simultaneous process for surface mount adhesive cure and solder

Details Simultaneous process for surface mount adhesive cure and solder Simultaneous process for surface mount adhesive cure and solder

1995-08-31

1997-06-17

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural diverse bonding

2282332, H05K 334

Patent

active

056390106

ABSTRACT:
A method for attaching a surface mount device to a circuit board includes applying a heat curable adhesive to the circuit board, applying solder paste with a predetermined melting temperature to the circuit board, placing the surface mount device on the adhesive, placing the circuit board into an oven where the circuit board is continuously heated to a first temperature until the adhesive is sufficiently cured so that it withstands reflow of the solder paste then to a second temperature to melt the solder paste.

REFERENCES:
patent: 4172547 (1979-10-01), DelGrande
patent: 4208005 (1980-06-01), Nate et al.
patent: 4314870 (1982-02-01), Ishida et al.
patent: 4398660 (1983-08-01), Pampalone et al.
patent: 4515304 (1985-05-01), Berger
patent: 4573105 (1986-02-01), Beldavs
patent: 4752027 (1988-06-01), Gschwend
patent: 4761881 (1988-08-01), Bora et al.
patent: 4771929 (1988-09-01), Bahr et al.
patent: 4998342 (1991-03-01), Bonnell et al.
patent: 5155904 (1992-10-01), Majd

Affiliated with

Also associated with

Rating

Simultaneous process for surface mount adhesive cure and solder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Simultaneous process for surface mount adhesive cure and solder , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Simultaneous process for surface mount adhesive cure and solder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2152952