Simultaneous planarization of pole piece and coil materials...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C029S603160

Reexamination Certificate

active

07025659

ABSTRACT:
A method for simultaneously planarizing to relatively equal smoothness a thin film magnetic head hardbaked resist structure having relatively low surface energy and one or more additional thin film magnetic head structures containing other materials having comparatively higher surface energy, such as copper, hardbaked resist, alumina and NiFe. The method begins with preparation of a chemical mechanical polishing (CMP) slurry targeted at equaling the removal rate of the materials to be planarized. The CMP slurry includes a liquid vehicle, an abrasive, and a surfactant. The CMP slurry is applied to the surface of the structures to be planarized and the structures are simultaneously planarized using a CMP planarization technique.

REFERENCES:
patent: 4544376 (1985-10-01), Duran
patent: 4677036 (1987-06-01), Nakamura et al.
patent: 4933209 (1990-06-01), Anthony et al.
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5465475 (1995-11-01), Kinoshita et al.
patent: 5890278 (1999-04-01), Van Kesteren
patent: 5940956 (1999-08-01), Jordan
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 6024886 (2000-02-01), Han et al.
patent: 6032353 (2000-03-01), Hiner et al.
patent: 6063306 (2000-05-01), Kaufman et al.
patent: 6076256 (2000-06-01), Drake et al.
patent: 6093333 (2000-07-01), Phipps
patent: 6099604 (2000-08-01), Sandhu et al.
patent: 6105238 (2000-08-01), Chesnutt et al.
patent: 6554878 (2003-04-01), Dill et al.
patent: 2002/0084243 (2002-07-01), Hsiao et al.
patent: 60177420 (1985-09-01), None
patent: 63117307 (1988-05-01), None
patent: 11302636 (1999-11-01), None
patent: WO 99/47618 (1999-09-01), None
IBM TDB, v.38, n.3, p. 37 J.Vac.Sci.Tech.B 18 (1) Jan./Feb. 2000 pp. 201-207.
Thin Solid Films 290-291(1996), pp. 447-452.

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