Simultaneous diffusion bonding of an array of like parts

Stock material or miscellaneous articles – All metal or with adjacent metals – Having aperture or cut

Reexamination Certificate

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C428S045000, C428S134000, C428S636000, C428S637000, C428S638000, C428S596000, C428S577000, C428S571000, C428S572000, C228S190000, C228S193000, C432S253000, C266S285000, C266S274000, C165S081000, C165S082000, C165S166000, C165S169000

Reexamination Certificate

active

06177203

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to diffusion bonding techniques and more particularly to apparatus which adapts such techniques to the simultaneous bonding of each of an array of parts such as laser diodes heat sinks.
BACKGROUND OF THE INVENTION
Diffusion bonding techniques are well known. Although such techniques are quite useful, they are limited to bonding of single items, mostly small but also, to some extent, to single relatively large area items. The techniques have not been used for simultaneous bonding of an array of like parts.
BRIEF DESCRIPTION OF THE INVENTION
In accordance with the principles of this invention, diffusion bonding techniques are extended to the simultaneous bonding of like parts such as multilayer-layer, heat sink assemblies for laser diodes. The invention is based on the recognition that changes in temperature during processing of an array of parts caused expansion and contraction of component layers of the parts in different portions of the array. This problem was overcome by providing a frame about the array of parts where the frame has a small hole at one corner of the frame and includes a slot at the opposite corner of the frame. The slot is aligned at a 45° axis and, accordingly, in response to any expansion or contraction during diffusion bonding results in the absence of misalignment of component layers in the parts of the array.


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