Simulation method for high resolution deep impurity profile

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

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H01L 21265

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059328819

ABSTRACT:
In a computer-implemented simulation method for implanting ions into a semiconductor substrate, a region is defined in a vertical cross-section of the substrate between first and second horizontal lines, the first horizontal line being spaced a distance R.sub.p -N.sigma. from a top surface of the substrate and the second horizontal line being spaced a distance R.sub.p +N.sigma. from the top surface, where R.sub.p is a projected range of implanted ions from the top surface, N is an integer, and .sigma. is a standard deviation of horizontal spread of an impurity profile. An orthogonal coordinate system is then defined by a set of narrowly spaced horizontal parallel lines within the region, a set of widely spaced horizontal parallel lines outside of the region and a set of vertical parallel lines at spacing which increases as a function of distance from opposite vertical edges of the coordinate system. A simulation of ion implantation is performed into the substrate and an impurity profile is obtained using the coordinate system.

REFERENCES:
patent: 4410801 (1983-10-01), Sakurai et al.
patent: 5096841 (1992-03-01), Miura et al.
patent: 5185273 (1993-02-01), Jasper
Supercomputing Technology, Fuji Sogo Kenkyujo, Hei 3-8, pp. 115-116.
Analysis and Simulation of Semiconductor Device, "Ion Implantation", pp. 52-53.
"Handou-Tai Soshi Simulator (Semiconductor Device Simulator)", H. Koike et al., Fuji-Sougou Kenkyujo, Maruzen Publishing Company, Aug. 25, 1991, pp. 108-117.
"Models for Implantation into Multilayer Targets", H. Ryssel et al., Appl. Phys., A 41,201-207 (1986).

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