Electricity: electrical systems and devices – Miscellaneous
Patent
1980-03-17
1981-07-28
Kucia, Richard R.
Electricity: electrical systems and devices
Miscellaneous
174 685, 361406, H05K 118
Patent
active
042813611
ABSTRACT:
A multilayer printed circuit board is disclosed having appropriate ground and voltage planes. The multilayer printed circuit board includes a mounting plane, a plurality of dielectric sheets stacked upon the mounting plane, a plurality of conductive sheets positioned between adjacent dielectric sheets, and a plurality of rectangular shaped apertures passing through the multilayer printed circuit board. Each rectangular shaped aperture of the multilayer printed circuit board has a plurality of voltage connector terminals. Electrical connection from one of the conductive sheets to the appropriate voltage connector terminal is provided by a conductive disc which passes through a hole located within the multilayer printed circuit board.
REFERENCES:
patent: 2984834 (1960-08-01), Kalfaian
patent: 3219886 (1965-11-01), Katzin
patent: 3312870 (1967-04-01), Rhoades
patent: 3340491 (1967-09-01), Deakin
patent: 3515156 (1970-06-01), Steranko
patent: 3593064 (1971-07-01), Wagner
patent: 3621338 (1971-11-01), Rogers
patent: 3704455 (1972-11-01), Scarbrough
patent: 3917983 (1975-11-01), Kuronen
patent: 4237522 (1980-12-01), Thompson
Ardito et al., Making Integral Multilayer Circuit Boards with Cable Conneons, IBM Tech. Dis. Bull., V. 14, #3, Aug. 1971, pp. 701 & 702.
Berke Herbert
Mendorf Donald R.
Patz Benjamin W.
Adams Robert W.
Kalmbaugh David S.
Kucia Richard R.
Sciascia Richard S.
The United States of America as represented by the Secretary of
LandOfFree
Simplified multilayer circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Simplified multilayer circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Simplified multilayer circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-551649