Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-09-12
2006-09-12
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C257S718000, C257S719000, C165S080300
Reexamination Certificate
active
07106594
ABSTRACT:
A heat transfer assembly comprising of an electronic component attached to an attachment point located on a circuit board and a clamping mechanism which applies a downward force against a block. In return, the block applies force against a heat transfer device which contacts the electronic component. The interface between the block and the heat transfer device contain a number of tongues and grooves to allow for positive location of the block against the heat transfer device while the clamping mechanism is fastened to the support. The positive location is configured for applying a localized force against a specific area on the electronic component.
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Parisi Mark Joseph
Vetter Stephan Michael
Chervinsky Boris
Delphi Technologies Inc.
Griffin Patrick M.
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