Electrical connectors – With circuit component or comprising connector which fully... – Termination circuit
Reexamination Certificate
1999-04-20
2001-05-01
Bradley, Paula (Department: 2833)
Electrical connectors
With circuit component or comprising connector which fully...
Termination circuit
C439S676000
Reexamination Certificate
active
06224425
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates generally to miniature electrical connectors used in printed circuit board and other microelectronic applications, and particularly to an improved microelectronic connector and method of fabricating the same.
2. Description of Related Technology
Existing microelectronic electrical connectors (such as those of the RJ 45 or RJ 11 type) frequently incorporate magnetics or other electrical components within the connector body itself. These components may provide a variety of signal conditioning functions, such as noise suppression or signal transformation. Often, the magnetics or electrical components are fabricated as part of a package or separate device and then subsequently mounted on a small circuit board; the circuit board assembly is then mounted within a rear connector body element or “trailer.” See FIG.
1
. The trailer
12
is received by the front connector body or sleeve
14
, the latter also receiving the modular plug (not shown). As shown in
FIG. 1
, a separate lead “carrier”
15
is also commonly used to maintain electrical separation between the leads
11
which mate with the modular plug. The lead carrier
15
is typically molded onto the leads at a location between the trailer and the distal end of the leads. See, for example, U.S. Pat. No. 5,587,884 assigned to the Whitaker Corporation, which describes a connector design incorporating both a trailer with circuit board and lead carrier.
However, the fabrication of such prior art connector designs typically requires a significant number of processing steps and labor, thereby increasing the cost. For example, fabrication of the lead carrier
15
shown in
FIG. 1
is a separate process step which requires positioning of the leads and subsequent molding of the carrier. Also the front portion of the connector body or sleeve
14
in such a connector is required to be designed to receive the leads
11
and carrier
15
molded thereon. Furthermore, the rear portion of the sleeve
14
often must be adapted to frictionally receive the trailer
12
(or alternatively, have the trailer “snap” into the sleeve) so as to maintain the sleeve, trailer, and leads in relative alignment. These design requirements for the sleeve ultimately translate to increased unit costs, since the molds are more complex and additional process steps are required.
Additionally, the use of a circuit board within the connector body or trailer may adversely impact the cost and/or reliability of the connector. The circuit board must be separately fabricated, one or more electrical components mounted on the board, electrical connections soldered, and the board ultimately mounted within the trailer of the connector. Furthermore, electrical leads to and from the board must be provided, adding further complexity.
One alternative to using a circuit board assembly is the use of a prefabricated microelectronic component package such as that described in U.S. patent application Ser. No. 07/570,894, filed Aug. 21, 1990 and assigned to Pulse Engineering, Inc., now U.S. Pat. No. 5,015,981. Such packages are routinely used to provide noise suppression or other signal conditioning functions in electronic devices. These devices are typically manufactured in a dual in-line package (DIP) configuration of the type well known in the electronic arts. Some of the benefits of such devices include their comparatively low manufacturing cost, relative simplicity, and high degree of reliability.
Based on the foregoing, it would be most desirable to provide an improved microelectronic connector design which would allow for a simpler and more cost effective method of connector fabrication. Such an improved design would avoid the use of a circuit board within the connector body, and could also make use of stand-alone electrical components or existing low cost, high reliability component package technology to further reduce the overall cost of manufacturing the connector and increase the reliability and durability of the final product.
SUMMARY OF THE INVENTION
The invention satisfies the aforementioned needs by providing an improved microelectronic connector and method of fabricating the same.
In a first aspect of the invention, an improved microelectronic connector is disclosed which utilizes a preformed electrical component (such as a choke coil) or component package molded directly within a connector body. The component or package leads are specially sized and shaped to facilitate easy connector assembly and mating with an external device such as a printed circuit board.
In a first embodiment of the invention, a simplified one-piece microelectronic connector is disclosed utilizing a unitary connector body which is molded around a component package. The package is a DIP-type device having leads which initially extend from the package and connector body. The connector body (including a series of parallel grooves) is molded around the package; the package leads are subsequently bent into position within the grooves to form electrical contacts within the connector which mate with those of a modular plug received within the front portion of the connector body. No lead carrier or internal circuit board for mounting the electrical component is used in this embodiment, thereby greatly simplifying its manufacture.
In a second embodiment of the invention, a two-piece microelectronic connector is disclosed which utilizes separate front (“sleeve”) and rear (“trailer”) portions to form the connector body. The trailer houses the electrical component (or package), and is mated with the sleeve. One set of electrical leads of the package is routed through apertures in the sleeve and subsequently bent into position within a modular plug receptacle of the sleeve to form electrical contacts which mate with those of the modular plug. The trailer and sleeve portions of the connector body are maintained in relative alignment by the bent package leads and optionally with adhesive or mechanical locking devices on the trailer and/or sleeve. As with the prior embodiment, the lead carrier and internal circuit board are obviated.
In a third aspect of the invention, improved methods for fabricating the microelectronic connectors described above are disclosed.
REFERENCES:
patent: 4695115 (1987-09-01), Talend
patent: 4726638 (1988-02-01), Farrar et al.
patent: 4772224 (1988-09-01), Talend
patent: 4995834 (1991-02-01), Hasegawa
patent: 5015204 (1991-05-01), Sakamoto et al.
patent: 5015981 (1991-05-01), Lint et al.
patent: 5069641 (1991-12-01), Sakamoto et al.
patent: 5139442 (1992-08-01), Sakamoto et al.
patent: 5178563 (1993-01-01), Reed
patent: 5282759 (1994-02-01), Sakamoto et al.
patent: 5397250 (1995-03-01), Briones
patent: 5399107 (1995-03-01), Gentry et al.
patent: 5403207 (1995-04-01), Briones
patent: 5456619 (1995-10-01), Belopolsky et al.
patent: 5475921 (1995-12-01), Johnston
patent: 5587884 (1996-12-01), Raman
patent: 5647767 (1997-07-01), Scheer et al.
patent: 5687233 (1997-11-01), Loudermilk et al.
patent: 5736910 (1998-04-01), Townsend et al.
patent: 5766043 (1998-06-01), Talend
patent: 5872492 (1999-02-01), Boutros
patent: 5876239 (1999-03-01), Morin et al.
patent: 654865 A1 (1995-05-01), None
patent: WO94/05059 (1994-03-01), None
International Search Report re PCT/US99/08650; Date of mailing of International Search Report: Aug. 3, 1999.
U.S. Patent Application No. 08/863,654, Filed May 27, 1997.
Bradley Paula
Knobbe Martens Olson & Bear LLP
Pulse Engineering Inc.
Ta Tho D.
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