Simplified method of making high strength resin bonded mica tape

Details Simplified method of making high strength resin bonded mica tape Simplified method of making high strength resin bonded mica tape

1984-11-15

1986-08-19

Ivy, C. Warren

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156330, 156182, 156192, 428240, 4283044, 428324, 428413, 428415, 428247, 525438, B32B 3112, B32B 1906, B32B 1902, C08L 6702

Patent

active

046067850

ABSTRACT:
A resin solution is made from (1) an adhesive resin, such as a polyester resin containing an adhesive component, (2) a mica bonding resin such as an epoxy resin containing both cycloaliphatic epoxy and novolac epoxy, and (3) latent curing agent for the mica bonding resin; where the resin solution is used to coat a mica-backing composite, to provide, when dried at a time and temperature only to remove solvent, a mica bond mica tape useful for wrapping electrical coils without splitting or loss of mica.

REFERENCES:
patent: 2980566 (1961-04-01), Wohlfahrt
patent: 3026222 (1962-03-01), Rogers
patent: 3778536 (1973-12-01), Smearing
patent: 3998983 (1976-12-01), Smith
patent: 4020017 (1977-04-01), Smith et al.
patent: 4091139 (1978-05-01), Quirk
patent: 4204181 (1980-05-01), Smith et al.
patent: 4296018 (1981-10-01), Smith
patent: 4491618 (1985-01-01), Kuwajima

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