Simplified method for direct electroplating of dielectric substr

Details Simplified method for direct electroplating of dielectric substr Simplified method for direct electroplating of dielectric substr

1991-12-12

1993-11-16

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

205125, 205167, 205187, 427301, C25D 554

Patent

active

052620425

ABSTRACT:
Improved methods for electroplating non-conducting substrates are disclosed utilizing aqueous saline adhesion promoter solutions and rinse solutions to enhance the surface deposition of colloidal metal activating catalysts to form conducting layers capable of direct electroplating. One variation of the process recycles excess activating catalyst into the aqueous saline adhesion promoter to eliminate waste.

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