Simplified housing structure including a heat sink for a semicon

Details Simplified housing structure including a heat sink for a semicon Simplified housing structure including a heat sink for a semicon

1975-09-05

1977-05-17

James, Andrew J.

357 70, 357 71, 357 74, 357 72, H01L 2302, H01L 2348, H01L 2946, H01L 2954

Patent

active

040245705

ABSTRACT:
A plastic housing structure, for a semiconductor component or integrated circuit, employing a metallic heat conducting member forming a base plate of the housing, the conductor members for electrical connection of the semiconductor component extending from the latter to the base plate and insulated therefrom by a plastic film, with the housing being suitable for reception of semiconductor components of integrated circuits and mounting thereof into conductor boards or layer circuits.

REFERENCES:
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3610870 (1971-10-01), Sakamoto
patent: 3662230 (1972-05-01), Redwantz
patent: 3724068 (1973-04-01), Galli
patent: 3820153 (1974-06-01), Quinn
patent: 3825803 (1974-07-01), Budde
patent: 3864728 (1975-04-01), Peltz et al.
patent: 3868725 (1975-02-01), Degraaf
patent: 3938177 (1976-02-01), Hansen et al.

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