Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-12-30
2000-08-29
Gandhi, Jayprakash N.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361752, 361801, 361807, 455 90, 379433, 220 402, H04B 138, H04M 100, H05K 502
Patent
active
061117609
ABSTRACT:
Multiple layers of electronic components are secured within a wireless communications device, such as a cellular telephone, by gripping the component layers between two different portions of the device's enclosure, thereby preventing substantial vertical movement of the component layers within the combined housing. A first housing section, typically the front portion of the device's shell housing, includes both a first set of holding surfaces and a second set of holding surfaces which are preferably, but not necessarily, lying in two different planes. Preferably, these holding surfaces are portions of fingers that extend downwardly away from the first housing section. When the two housing sections are joined, the first set of holding surfaces directly contacts the lower component layer and presses the same against the second housing section. Likewise, the second set of holding surfaces directly contacts the second component layer and presses the same against the second housing section. In this manner, the first and second component layers are vertically trapped between the first and second housing sections. The two housing portions may be joined in any manner known in the art, such as by screws or ultrasonic welding; but the two housing portions are preferably snap-fitted together using snap teeth on the aforementioned fingers and corresponding recesses in the rear housing portion. In some embodiments, the enclosure described above is adapted to secure additional component layers by adding additional sets of holding surfaces to the appropriate housing section. Such an approach allows for easier and less expensive assembly and may allow for thinner devices to be made.
REFERENCES:
patent: 4912602 (1990-03-01), Zurek et al.
patent: 5117330 (1992-05-01), Miazga
patent: 5596487 (1997-01-01), Castaneda et al.
patent: 5613237 (1997-03-01), Bent et al.
patent: 5946395 (1999-08-01), Petrella et al.
Ericsson Inc.
Gandhi Jayprakash N.
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