Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-10-04
1997-06-10
Sells, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156292, 156293, 1563096, 264445, B32B 3116
Patent
active
056371667
ABSTRACT:
A method of attaching a flexible interconnection circuit assembly to an ink-jet pen cartridge. The cartridge includes a frame structure fabricated of a rigid plastic frame member formed of a first plastic material and a polymeric second material molded to the frame member. A headland region is defined at the tip of a snout region of the cartridge. An ink reservoir is connected through a standpipe defined by the rigid frame material with the headland region. The second plastic material coats the headland region, and portions of flap and tab sides of the snout regions. The interconnection circuit assembly includes a thermoplastic cover layer, a flexible tab circuit and a printhead die and orifice plate affixed to the tab circuit. The interconnection assembly is attached to the headland region after alignment by heatstaking the polymeric second plastic material covering cheek areas of the headland region and areas of the flap and tab sides of the snout region to corresponding areas of the cover layer of the assembly. This results in a strong chemical bond securing the flexible interconnection circuit to the cartridge.
REFERENCES:
patent: 4500895 (1985-02-01), Buck et al.
patent: 4600927 (1986-07-01), Sugitani
patent: 4683481 (1987-07-01), Johnson
patent: 4859378 (1989-08-01), Wolcott
patent: 4926197 (1990-05-01), Childers et al.
patent: 4967208 (1990-10-01), Childers
patent: 5189787 (1993-03-01), Reed et al.
patent: 5198834 (1993-03-01), Childers et al.
patent: 5278584 (1994-01-01), Keefe et al.
patent: 5297331 (1994-03-01), Childers
patent: 5408738 (1995-04-01), Schantz et al.
patent: 5420627 (1995-05-01), Keefe et al.
patent: 5435863 (1995-07-01), Frantz
patent: 5440333 (1995-08-01), Sykora et al.
patent: 5442384 (1995-08-01), Schantz et al.
patent: 5442386 (1995-08-01), Childers et al.
patent: 5450113 (1995-09-01), Childers et al.
patent: 5451995 (1995-09-01), Swanson et al.
Branson Sonic Power Company, "Ultrasonic Plastics Assembly", 1979, pp. 49-52.
Zerox Disclosure Journal, "Wire Bond Encapsulation Method For Full Width Semiconductor Arrays,"vol. 17, No. 5, Sep./Oct. 1992, pp.305-308.
Hewlett-Packard Journal, vol. 36, No. 5, May 1985.
Hewlett-Packard Journal, vol. 39, No. 4, Aug. 1988.
Childers Winthrop D.
Marler Jaren D.
Swanson David W.
Hewlett--Packard Company
Sells James
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