Coating processes – Electrical product produced – Metal coating
Patent
1992-06-04
1995-01-24
Beck, Shrive
Coating processes
Electrical product produced
Metal coating
427123, C23C 2600
Patent
active
053841557
ABSTRACT:
The invention is to a method of spot plating parts of a plated semiconductor lead frame. The entire lead frame is first plated. Then parts of the lead frame, internal to the subsequent encapsulating package, are spot plated prior to encapsulating the semiconductor device. A spot of silver is plated in the mount and/or bond area of the lead frame.
REFERENCES:
patent: 4800178 (1989-01-01), Mathew
patent: 5138431 (1992-08-01), Huang
patent: 5146312 (1992-09-01), Lim
Abbott Donald C.
Fritzsche Robert M.
Beck Shrive
Brady Wade James
Courtney Mark E.
Dang Vi Duong
Donaldson Richard L.
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