Compositions – Electrically conductive or emissive compositions – Metal compound containing
Patent
1991-10-10
1993-10-05
Lieberman, Paul
Compositions
Electrically conductive or emissive compositions
Metal compound containing
252519, 252514, 420502, 420504, H01B 100, H01B 102, H01B 108
Patent
active
052502295
ABSTRACT:
The invention is directed to a thermal cycle adhesion additive composition consisting essentially of an admixture of finely divided particles of oxides of bismuth, copper, lead, zinc, and transition metal and to conductive thick film compositions made therefrom.
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Hara Hiroyuki
La Branche Marc H.
Taylor Barry E.
E. I. Du Pont de Nemours and Company
Kopec Mark
Lieberman Paul
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