Silver polish formulation containing thiourea

Details Silver polish formulation containing thiourea Silver polish formulation containing thiourea

1997-06-05

1999-09-28

Douyon, Lorna

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

510245, 510254, 510255, 510263, 510401, 510402, 510439, 510446, 510477, 510509, C11D 708, C11D 1706, C23G 110

Patent

active

059588543

ABSTRACT:
A chemical cleaning composition for silver- or copper-containing surfaces consists of a water-soluble solid or powder comprising thiourea or a derivative thereof, and is formulated in unit application form, e.g. in tablet or sachet form. A preferred composition comprises up to 60% thiourea or a derivative thereof; up to 4% surfactant; not more than 40% acidifier; less than 20% disintegrant; up to 10% binder; 0-1% lubricant; and up to 40% diluent.

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Abstract for Japanese Patent No. 4-214884, Aug. 5, 1992.

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