Silver plating solution and silver plating process and pretreatm

Details Silver plating solution and silver plating process and pretreatm Silver plating solution and silver plating process and pretreatm

1984-01-26

1986-08-05

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 346, C25D 534

Patent

active

046041672

ABSTRACT:
A cyclic thion compound is incorporated as an anti-immersion agent into a cyanide-containing silver plating solution for use in silver plating onto a copper or copper alloy surface or into a pre-dipping solution for use in treating the copper or copper alloy surface before the silver plating using a cyanide-containing silver plating solution. Immersion deposition of silver on the copper or copper alloy surface is prevented, and a plated article free of defects and having good plating properties is obtained even if cyanogen is contained at a relatively high concentration in the plating solution.

REFERENCES:
patent: 4247372 (1981-01-01), Nobel et al.

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