Chemistry: electrical and wave energy – Processes and products
Patent
1975-10-28
1977-05-17
Edmundson, F.C.
Chemistry: electrical and wave energy
Processes and products
C25D 348
Patent
active
040240312
ABSTRACT:
A plating process system has been disclosed which provides for a strike bath, a low current density plating bath or a high speed plating bath, the last for production of electroplating deposits with current densities in excess of 200 ASF; additionally, the strike bath may be used with the low current density plating bath as a combination, or as another combination, the strike bath is with the high speed, high current plating bath; the advantages are a compatible strike and plating bath; nonstaining deposits; buffered pH operations; neutral pH; no free cyanide in bath; elimination of drag-in problems from a strike bath vessel to plating bath vessel; reduced drag-out from this bath; higher current density capability and higher current density for lower total initial concentration in solution when compared to commercial baths presently available; the deposits are especially useful for high purity integrated circuits and provide an alternate system to gold for microelectronic circuits without any increased operation requirements.
REFERENCES:
patent: 744170 (1903-11-01), Darlay
patent: 2435525 (1948-02-01), Williams et al.
patent: 2504272 (1950-04-01), McCoy
patent: 3174918 (1965-03-01), Rinker et al.
patent: 3427232 (1967-02-01), Natwick
patent: 3691032 (1972-09-01), Lubonsky et al.
AMP Incorporated
Edmundson F.C.
Egan Russell J.
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