Silver paste for forming conductive layers

Details Silver paste for forming conductive layers Silver paste for forming conductive layers

2007-05-25

2011-12-06

Kopec, Mark (Department: 1761)

Compositions

Electrically conductive or emissive compositions

Free metal containing

Reexamination Certificate

active

08070986

ABSTRACT:
The present invention provides a silver paste for forming electrically conductive pattern comprising 0.1 to 60 wt % of a silver C0 to C12 aliphatic carboxylate; 1 to 80 wt % of silver powder; 0.1 to 15 wt % of a binder; and a residual organic solvent.The silver paste composition according to the present invention has advantages in that it produces micro-structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the electrically conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles.

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“International Search Report” for PCT/KR2007/002533, Korean Intellectual Property Office, Oct. 25, 2007, 2 page, Daejeon, Republic of Korea.
“Written Opinion” for PCT/KR2007/002533, Korean Intellectual Property Office, Oct. 25, 2007, 4 pages, Daejeon, Republic of Korea.
“International Preliminary Report” for PCT/KR2007/002533, Korean Intellectual Property Office, Aug. 4, 2009, 5 pages, Daejeon, Republic of Korea.

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