Silver palladium alloy

Alloys or metallic compositions – Silver base – Copper containing

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420587, 148430, 148442, C22C 506, C22C 508, C22C 3000

Patent

active

054845696

ABSTRACT:
A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modifying elements selected from the group consisting of ruthenium, zirconium and platinum. This alloy exhibits high oxidation and tarnish resistance and is formed into wrought electronic components such as contacts and brushes to provide low noise.

REFERENCES:
patent: 1935897 (1933-11-01), Wise
patent: 2138599 (1938-11-01), Gwyn
patent: 2222544 (1940-12-01), Spanner et al.
patent: 4350526 (1982-09-01), Schaffer
patent: 4980245 (1990-12-01), Marino
patent: 5000779 (1991-03-01), German et al.

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