Silver layer formed by electrosilvering substrate material

Details Silver layer formed by electrosilvering substrate material Silver layer formed by electrosilvering substrate material

2007-07-05

2011-11-22

Speer, Timothy M (Department: 1784)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S671000, C428S687000, C205S263000

Reexamination Certificate

active

08062765

ABSTRACT:
The inventors have conducted vigorous studies, and discovered as a result that it is possible to form a silver layer having a high reflectance of about 90 to 99% in a visible light area by setting a grain size of an outermost surface of a silver plated layer within a range of 0.5 μm or more to 30 μm or less.

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English language Abstract JP 7-231152.
English language Abstract JP 2006-155899.
Bersirova et al., “Electrodeposition of functional silver coatings from buffered baths,”Chemija14(1):16-21 (2003), XP002481380.
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The Official Action (in Japanese).
English language Abstract of CN2754213.
Taiwanese Office Action dated Jun. 23, 2011, and an English language translation thereof, in counterpart Taiwanese patent application No. 096124730.

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