Silver halide light sensitive photographic material

Details Silver halide light sensitive photographic material Silver halide light sensitive photographic material

1998-05-20

2000-04-04

Huff, Mark F.

Radiation imagery chemistry: process, composition, or product th

Radiation sensitive product

Two or more radiation-sensitive layers containing other than...

430558, 430559, 430567, 430966, G03C 1035, G03C 135, G03C 140, G03C 516

Patent

active

060459840

ABSTRACT:
A silver halide light sensitive photographic material is disclosed, comprising component layers including a silver halide emulsion layer and a hydrophilic colloid layer, wherein the silver halide emulsion layer comprises tabular grains and at least one of the component layers layers contains a leuco compound capable of forming a dye upon reaction with an oxidation product of a developing agent; the tabular grains 1) having (111) major faces, and exhibiting an average equivalent circular diameter of 0.5 to 3.0 .mu.m and an average thickness of 0.07 to 0.3 .mu.m, 2) including epitaxially deposited silver halide protrusions of a face-centered cubic crystal lattice structure forming epitaxial junctions with the tabular grains, and 3) the protrusion being located on peripheral portions of the tabular grains.

REFERENCES:
patent: 4435501 (1984-03-01), Maskasky
patent: 4865958 (1989-09-01), Abbott et al.
patent: 5707792 (1998-01-01), Yamada et al.
patent: 5874206 (1999-02-01), Kimura et al.
European Search Report EP 98 10 9221.
EPO Patent Abstracts of Japan Publication #03153234.

Affiliated with

Also associated with

Rating

Silver halide light sensitive photographic material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silver halide light sensitive photographic material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silver halide light sensitive photographic material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-363720