Silver-glass pastes

Compositions – Electrically conductive or emissive compositions – Free metal containing

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106 114, 501 19, 501 20, H01B 102, H01C 102

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active

051641194

ABSTRACT:
An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.

REFERENCES:
patent: 3350341 (1967-10-01), Short
patent: 3374110 (1968-03-01), Miller
patent: 3898091 (1975-08-01), Stout
patent: 4401767 (1983-08-01), Dietz et al.
patent: 4436785 (1984-03-01), Dietz et al.
patent: 4459166 (1984-07-01), Dietz et al.
patent: 4636254 (1987-01-01), Husson, Jr. et al.
patent: 4657589 (1987-04-01), Barajas
patent: 4761224 (1988-08-01), Husson, Jr. et al.
patent: 4881974 (1989-11-01), Herrington
patent: 4933030 (1990-06-01), Dietz
patent: 4986849 (1991-01-01), Nguyen et al.
Chemical Abstracts, vol. 83, No. 10, 08; Sep. 1975, p. 741.
IBM Technical Disclosure Bulletin, vol. 11, No. 9, Feb. 1969; New York US, p. 1077, Milkovich et al., "Vehicle for Silver-Palladium Conductive Paste".

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