Silver-filled glass

Details Silver-filled glass Silver-filled glass

1982-03-08

1983-08-30

McCarthy, Helen M.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

106 113, 106 114, 106285, 106290, 156325, 252514, 357 67, 357 75, 361400, 361411, 428208, 428209, 428210, 428448, 501 20, 501 22, 501 75, 501 76, B22F 702, C03C 310, H05K 706, H01L 2310

Patent

active

044017677

ABSTRACT:
A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

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Geller, R. F. et al.-Some Soft Glazes of Low Thermal Expansion-J. of Research of Nat'l. Bureau of Standards, 20, Jan. 1938, pp. 57-66, p. 61 relied on, Res. Paper 1064, "Density Measurements of Powders Used in Paste for the Microelectronics Industry".
Scramaglia, R., "Powder Properties Affect Fired Film", Ceramic Industry 119, (5), Nov. 1982, pp. 44-46.
Greenwood, R. W., "Silver Bearing Conductive Pastes", IBM Tech. Discl. Bull., Jul. 1974, 17, (2), p. 437.

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