Silver-filled glass

Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...

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501 20, 501 46, 106 114, C03C 818

Patent

active

049961713

ABSTRACT:
Silver-filled glass pastes useful for the attachment of silicon semi-conductor devices (dies) to substrates comprise particulate silver and a lead phosphate glass, together with conventional organic components. The pastes have low bonding temperatures, and give good adhesion at firing temperatures of 350.degree. to 460.degree. C.

REFERENCES:
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patent: 4401767 (1983-08-01), Dietz et al.
patent: 4436785 (1984-03-01), Dietz et al.
patent: 4459166 (1984-07-01), Dietz et al.
patent: 4636254 (1987-01-01), Husson, Jr. et al.
patent: 4743302 (1988-05-01), Dumesnil et al.
patent: 4761224 (1988-08-01), Husson, Jr. et al.

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