Silver-electroplating method using thiocyanic solution

Details Silver-electroplating method using thiocyanic solution Silver-electroplating method using thiocyanic solution

1978-05-31

1979-05-08

Williams, Howard S.

Chemistry: electrical and wave energy

Processes and products

204 46R, C25D 346, C25D 510

Patent

active

041535197

ABSTRACT:
An electroplating method using an aqueous solution containing thiocyanic ions in an amount of 0.5 to 10 moles/l, silver ions in an amount of 0.04 to 0.8 mole/l and a film improving agent in an amount effective to suppress a local growth of a silver film on a metallic substrate to be plated, which comprises subjecting, prior to the electroplating, the metallic substrate to a preplating step under a current density of 0.1 to 80 mA/dm.sup.2 in an aqueous solution containing silver ions in an amount of 0.001 to 0.02 mole/l and thiocyanic ions in an amount of 0.1 to 5 moles/l whereby the adhesiveness of the resulting electroplated silver film to the substrate is improved.

REFERENCES:
patent: 2783194 (1957-02-01), Nobel et al.
patent: 3984292 (1976-10-01), Culjkovic
Domnikov, Metal Finishing (Apr., 1966) vol. 64, No. 4 pp. 57-59.

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