Silver base activating solutions for electroless copper depositi

Details Silver base activating solutions for electroless copper depositi Silver base activating solutions for electroless copper depositi

1976-07-19

1978-04-04

Kendall, Ralph S.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

427304, 427306, 423279, 423593, 423602, C23C 302

Patent

active

040825574

ABSTRACT:
A silver base activating solution, for use prior to electroless copper deposition, contains a salt of a weak oxyacid of an element of group III, IV, V or VI of the periodic system, e.g. sodium tetraborate. A relatively low silver concentration, within the range of 0.01 g/l to 1 g/l can accordingly be used; and the resulting copper coating forms quickly and is compact, smooth and adherent. The silver solution is stable.

REFERENCES:
patent: 2630444 (1953-03-01), Fugassi et al.
patent: 2785106 (1957-03-01), Mendelsohn
patent: 3093509 (1963-06-01), Wein
patent: 3122449 (1964-02-01), Swanson

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