Silver and silver alloy plating bath

Details Silver and silver alloy plating bath Silver and silver alloy plating bath

2000-05-02

2009-12-08

Tran, Thao T. (Department: 1794)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

C205S238000, C205S263000, C106S001230

Reexamination Certificate

active

07628903

ABSTRACT:
A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobis(triglycerol), 3,3′-thiodipropanol, thiodiglycerin, 3,6-dithiooctane-1,8-diol, and the like, which contain at least one or more of an ether oxygen atom, a 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, and not containing a basic nitrogen atom. Compared to baths containing aliphatic monosulfide compounds, such as thiodiglycol or beta-thiodiglycol, which do not contain an ether oxygen atom, 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, by having these particular compounds, the plating bath of the present invention has excellent stability over extended time, excellent co-deposition of silver and various metals, and excellent appearance of the electrodeposition coating.

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patent: 0 666 342 (1995-01-01), None
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patent: 09143786 (1997-06-01), None
patent: 11269691 (1999-10-01), None
patent: WO-99/41433 (1999-08-01), None
Patent Abstracts of Japan for JP09-143786 published on Jun. 3, 1997.

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