Silver alloys for metallization of magnetic bubble domain device

Specialized metallurgical processes – compositions for use therei – Processes – Free metal or alloy reductant contains magnesium

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75173R, 357 65, C22C 500

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041704711

ABSTRACT:
There is described a metal alloy which provides improved operating characteristics and parameters for, inter alia, magnetic bubble domain devices.

REFERENCES:
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patent: 2353254 (1944-07-01), McCandless
patent: 3082521 (1963-03-01), Cohen
patent: 3669655 (1972-06-01), Cox
patent: 3874941 (1975-04-01), Shibata
D'Heurle, "The Thin Film Stripes. . ." IBM-TDB, 14, 1971, 596.
Prokop et al., "Electromigration. . .Al-Si Contacts" J. Appl. Phys. 43 1972, 2595.

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