Siloxane polyimide and heat-resistant adhesive containing the sa

Details Siloxane polyimide and heat-resistant adhesive containing the sa Siloxane polyimide and heat-resistant adhesive containing the sa

1998-02-03

1999-08-24

Glass Moore, Margaret W.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

525430, 525431, 525476, 528 28, 528 38, C08G 7726

Patent

active

059425920

ABSTRACT:
A solvent-soluble siloxane polyimide comprising a copolymer obtained by reaction of a diamine compound mixture comprising a diaminopolysiloxane, an alicyclic diamine and an aromatic diamine with an aromatic tetracarboxylic acid anhydride, followed by polyimidization reaction of the resulting polyamic acid forms a heat-resistant adhesive by adding an epoxy resin, a diamine-based curing agent and an organic solvent thereto, The formed adhesives provides a distinguished curling resistance without any warp when the resulting siloxane polyimide soluble in ordinary organic solvents is used as a main component of the adhesive for bonding between a base material and a copper foil of a flexible printed substrate.

REFERENCES:
patent: 5859181 (1999-01-01), Zhao et al.

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