Siloxane-epoxy molding compound with improved crack resistance

Details Siloxane-epoxy molding compound with improved crack resistance Siloxane-epoxy molding compound with improved crack resistance

1978-06-21

1980-05-13

Jacobs, Lewis T.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 37EP, C08L 8304

Patent

active

042028116

ABSTRACT:
An improved curable siloxane-epoxy molding composition which is a blend of a phenylpolysiloxane, an aluminum catalyst, a silica filler, and an aromatic polyepoxide resin which contains at least 38 percent by weight of a polydiglycidyl ether of a bisphenol is disclosed. The molding composition has improved thermal shock crack resistance when used to encapsulate electronic devices.

REFERENCES:
patent: 3842141 (1974-10-01), Fetscher et al.
patent: 3971747 (1976-07-01), Bank et al.
patent: 4082719 (1978-04-01), Liles et al.
patent: 4125510 (1978-11-01), Antonen
Lee et al., Handbook of Epoxy Resins, McGraw-Hill, Inc., 1967, p. 16-3.

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