Silicone resin electronic device encapsulant

Stock material or miscellaneous articles – Sheet including cover or casing – Complete cover or casing

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427 96, 4273762, C23C 2600

Patent

active

052158012

ABSTRACT:
An electronic device (12) is encapsulated by a curable material (15) which, prior to cure, comprises sixteen to twenty-three weight percent of a silicone resin, forty-six to seventy-three weight percent of silicon dioxide, four to fifteen weight percent of silicon hydride, and six to twenty-five weight percent of xylene. The silicone resin is selected from the group consisting of polydimethylsiloxane, polymethylphenylsiloxane, and a mixture of polydimethylsiloxane and polymethylphenylsiloxane. The silicone resin contains a platinum catalyst and has vinyl and/or hydride functional components.

REFERENCES:
patent: 4059708 (1977-11-01), Heiss
patent: 4118595 (1978-10-01), Pfahnl
patent: 4163072 (1979-07-01), Soos
patent: 4278784 (1981-07-01), Wong
patent: 4318939 (1982-03-01), Wong
patent: 4366187 (1982-12-01), Gabriel
patent: 4508758 (1985-04-01), Wong
patent: 4564562 (1986-01-01), Wong
patent: 4720431 (1988-01-01), Wong
patent: 4888226 (1989-12-01), Wong
patent: 5051275 (1991-09-01), Wong
patent: 5085913 (1992-02-01), Wong
"Electrical Performance and Reaction Kinetics of Silicone Gels," by C. P. Wong, Journal of Material Research, vol. 5, No. 4, Apr. 1990, pp. 795-800.
"Understanding the Use of Silicone Gels for Nonhermetic Plastic Packaging," by C. P. Wong et al., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 12, No. 4, Dec. 1989, pp. 421-425.
"Monolithic High Voltage Gated Iode Crosspoint Array IC," by H. T. Weston et al., International Electron Devices Meeting Technical Digest, 1982, pp. 85-88.

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