Silicone resin composition for die bonding

Details Silicone resin composition for die bonding Silicone resin composition for die bonding

2011-05-31

2011-05-31

Gulakowski, Randy (Department: 1766)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

C528S010000, C528S015000, C528S031000, C528S032000, C528S033000, C525S478000

Reexamination Certificate

active

07951891

ABSTRACT:
A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23° C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.

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