Silicone material

Details Silicone material Silicone material

1990-04-27

1992-02-04

Thomas, Alexander S.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

428 68, 428447, 357 72, 427 96, 26427213, 26427217, B32B 904, B31B 3126

Patent

active

050859137

ABSTRACT:
An electronic device employs as a dielectric (17) a silicone resin consisting essentially of (a) about twenty-one to twenty-five percent by weight of a silicone resin consisting essentially of dimethylsiloxane, and/or dimethylmethylphenylsiloxane, and/or dimethyl-diphenylsiloxane, (b) about seventy to eighty percent by weight of a silica filler, (c) about 0.5 to 0.7 percent by weight of a tin catalyst, and (d) about 0.057 to 0.26 percent by weight of copper (II) benzoylacetonate.

REFERENCES:
patent: 4564562 (1986-01-01), Wong
patent: 4888226 (1989-12-01), Wong
C. P. Wong, "Integrated Circuit Device Encapsulants," Chapter 3 in Polymers for Electronic Applications, edited by J. H. Lai, (CRC Press, Inc., Boca Katon, FL 12/1989), pp. 63-92.

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