Silicone epoxy curable compositions

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

260 37EP, 260824EP, 260825, 260 465R, C08L 6302, C08L 8306, C08G 5902

Patent

active

040827194

ABSTRACT:
The admixing of a small amount of an organosilicon compound containing at least one silicon-bonded hydrogen atom with curable compositions comprising a hydroxyl-containing organosilicon compound, an epoxy compound and certain catalytic aluminum compounds to improve the performance of the cured composition is disclosed. The improved compositions are especially useful as a resin binder in molding compounds that are used to mold electronic devices.

REFERENCES:
patent: 3070559 (1962-12-01), Nitzsche et al.
patent: 3131161 (1964-04-01), Nitzsche et al.
patent: 3842141 (1974-10-01), Fetscher et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Silicone epoxy curable compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silicone epoxy curable compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicone epoxy curable compositions will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-723264

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.