Silicone encapsulant composition for molding small shapes

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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Details

C528S031000, C528S032000, C528S043000

Reexamination Certificate

active

08071697

ABSTRACT:
A process includes the steps of: 1) heating a mold at a temperature ranging from 100° C. to 200° C.; 2) feeding a silicone encapsulant composition including a mold release agent, where the composition has a viscosity ranging from 100 cps to 3,000 cps at operating temperatures of the process, to an assembly for preventing the silicone encapsulant composition from flowing backward out of the assembly; 3) injecting the silicone encapsulant composition from the assembly into a mold having a horizontal orientation and having a mold cavity through a gate, where the mold cavity has a top and a bottom, a vent is located at the top of the mold cavity, the vent comprises a channel 0.1 mm to 1 mm wide by 0.0001 mm to 0.001 mm deep, the gate is located at the bottom of the mold cavity, and injecting is performed at a pressure ranging from 1,000 psi to 10,000 psi for up to 5 seconds; 4) holding the silicone encapsulant composition at 1,000 psi to 10,000 psi for an amount of time sufficient to prevent the silicone encapsulant composition from flowing out of the mold cavity; 5) curing the product of step 4). Lenses for LED packages may be prepared by the process.

REFERENCES:
patent: 3915924 (1975-10-01), Wright
patent: 3974122 (1976-08-01), Sato et al.
patent: 4085084 (1978-04-01), Merrill
patent: 4780510 (1988-10-01), Uemiya et al.
patent: 5116369 (1992-05-01), Kushibiki et al.
patent: 5127811 (1992-07-01), Trethowan
patent: 5233007 (1993-08-01), Yang
patent: 5236970 (1993-08-01), Christ et al.
patent: 5239035 (1993-08-01), Maxson
patent: 5266352 (1993-11-01), Filas et al.
patent: 5272013 (1993-12-01), Raleigh et al.
patent: 5314979 (1994-05-01), Okinoshima et al.
patent: 5376694 (1994-12-01), Christ et al.
patent: 5384383 (1995-01-01), Legrow et al.
patent: 5420213 (1995-05-01), Yang
patent: 5444106 (1995-08-01), Zhou et al.
patent: 5494946 (1996-02-01), Christ et al.
patent: 5512609 (1996-04-01), Yang
patent: 5541278 (1996-07-01), Raleigh et al.
patent: 5594424 (1997-01-01), Louy et al.
patent: 5623029 (1997-04-01), Yang
patent: 5673995 (1997-10-01), Segaud
patent: 5739948 (1998-04-01), Kushibiki et al.
patent: 5900456 (1999-05-01), Hashiuchi et al.
patent: 5955542 (1999-09-01), Davis et al.
patent: 6066172 (2000-05-01), Huo et al.
patent: 6174079 (2001-01-01), Buard et al.
patent: 6174983 (2001-01-01), Czech et al.
patent: 6274924 (2001-08-01), Carey et al.
patent: 6277147 (2001-08-01), Christ et al.
patent: 6361561 (2002-03-01), Huo et al.
patent: 6399734 (2002-06-01), Hodd et al.
patent: 6483981 (2002-11-01), Krahn et al.
patent: 6509423 (2003-01-01), Zhu et al.
patent: 6568822 (2003-05-01), Boyd et al.
patent: 6613343 (2003-09-01), Dillingham et al.
patent: 6645246 (2003-11-01), Weinschenk et al.
patent: 6727303 (2004-04-01), Ono et al.
patent: 6737496 (2004-05-01), Hodd et al.
patent: 6777522 (2004-08-01), Lai et al.
patent: 6798792 (2004-09-01), Itoh
patent: 6805712 (2004-10-01), Lai
patent: 6806509 (2004-10-01), Yoshino et al.
patent: 6815520 (2004-11-01), Yoneda et al.
patent: 6844414 (2005-01-01), Lai et al.
patent: 6864341 (2005-03-01), Lai et al.
patent: 6864342 (2005-03-01), Lai et al.
patent: 7625986 (2009-12-01), Yoshitake et al.
patent: 2002/0001320 (2002-01-01), Itoh
patent: 2002/0055778 (2002-05-01), Huo et al.
patent: 2002/0161140 (2002-10-01), Yoneda et al.
patent: 2002/0169505 (2002-11-01), Jethmalani et al.
patent: 2003/0130465 (2003-07-01), Lai et al.
patent: 2003/0134977 (2003-07-01), Lai et al.
patent: 2003/0158309 (2003-08-01), Ono et al.
patent: 2003/0162929 (2003-08-01), Lambertine
patent: 2003/0234458 (2003-12-01), Gardner et al.
patent: 2003/0235383 (2003-12-01), Gardner et al.
patent: 2004/0023822 (2004-02-01), Ochs et al.
patent: 2004/0075100 (2004-04-01), Bogner et al.
patent: 2004/0155373 (2004-08-01), Lai et al.
patent: 2004/0158019 (2004-08-01), Lai et al.
patent: 2004/0158020 (2004-08-01), Lai et al.
patent: 2004/0178509 (2004-09-01), Yoshino et al.
patent: 2004/0198924 (2004-10-01), Young et al.
patent: 2004/0236057 (2004-11-01), Chevalier et al.
patent: 2004/0245326 (2004-12-01), Lai
patent: 2004/0257191 (2004-12-01), Muller
patent: 2004/0257634 (2004-12-01), Chakrapani et al.
patent: 2005/0002105 (2005-01-01), Nemoto et al.
patent: 2005/0025442 (2005-02-01), Kodama et al.
patent: 2005/0038219 (2005-02-01), Lai et al.
patent: 2005/0070626 (2005-03-01), Lowery
patent: 2005/0213341 (2005-09-01), Wehner
patent: 2005/0287372 (2005-12-01), Gervasi et al.
patent: 2006/0001036 (2006-01-01), Jacob et al.
patent: 2006/0105485 (2006-05-01), Basin et al.
patent: 2007/0004891 (2007-01-01), Ichinohe
patent: 2007/0112147 (2007-05-01), Morita et al.
patent: 100 52 068 (2002-05-01), None
patent: 0 585 046 (1994-03-01), None
patent: 2 073 765 (1981-10-01), None
patent: WO 01/74554 (2001-10-01), None
patent: WO 03/066707 (2003-08-01), None
patent: WO 2004/037927 (2004-05-01), None
patent: WO 2005/017995 (2005-02-01), None
patent: WO 2006/033375 (2006-03-01), None
patent: WO 2006/045320 (2006-05-01), None
Abstract—JP 01-105418, published Apr. 21, 1989, Bridgestone Corp (applicant).
Norris, A., et. al., “Silicone polymers for optical films and devices,” Linear and Nonlinear Optics of Organic Materials II, 2002, pp. 79-86, vol. 4798, SPIE.
Su, Kai, et. al., “Siloxane Materials for Optical Applications,” Materials and Nanotechnologies, 2005, pp. 60291C1-60291C8, vol. 6029, SPIE.
Norris, Ann W., et. al., “Novel Silicone Materials for LED Packaging,” 2005, pp. 594115-1-594115-7, vol. 5941, SPIE, Bellingham, WA.

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