Silicone encapsulant

Details Silicone encapsulant Silicone encapsulant

1991-12-05

1993-05-25

Thomas, Alexander S.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

428 68, 428447, 257787, B32B 326, H01L 2328

Patent

active

052138640

ABSTRACT:
An electronic device encapsulant comprises polydimethyldiphenylmethylphenylsiloxane in which the mole ratio of the sum of the methyl-phenyl and diphenyl groups to the dimethyl groups is in the range of ten to forty percent. The normal bi-functional hydride terminations are replaced with tri-functional or tetra-functional hydride terminations.

REFERENCES:
patent: 4888226 (1989-12-01), Wong
patent: 5051275 (1991-09-01), Wong
patent: 5085913 (1992-02-01), Wong
"Electrical Performance and Reaction Kinetics of Silicone Gels," by C. P. Wong, Journal of Materials Research, vol. 5, No. 4, Apr. 1990, pp. 795-800.
"Understanding the Use of Silicone Gels for Non-Hermetic Plastic Packaging," by C. P. Wong et al., IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 12, No. 4, Dec. 1989, pp. 421-425.

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